Indlela yokudibanisa i-Optoelectronic

I-Optoelectronicindlela yokudibanisa

Ukuhlanganiswa kweiifotonikikunye ne-elektroniki linyathelo elibalulekileyo ekuphuculeni amandla eenkqubo zokucubungula ulwazi, ukuvumela amazinga okudluliselwa kwedatha akhawulezileyo, ukusetyenziswa kwamandla okuphantsi kunye noyilo lwezixhobo ezincinci, kunye nokuvula amathuba amatsha amakhulu oyilo lwenkqubo. Iindlela zokudibanisa ngokubanzi zahlulwe zibe ziindidi ezimbini: ukuhlanganiswa kwe-monolithic kunye nokuhlanganiswa kwe-multi-chip.

Ukuhlanganiswa kweMonolithic
Ukuhlanganiswa kwe-monolithic kubandakanya ukuvelisa izinto ze-photonic neze-elektroniki kwi-substrate efanayo, ngokuqhelekileyo kusetyenziswa izixhobo kunye neenkqubo ezihambelanayo. Le ndlela igxile ekudaleni ujongano olungenamthungo phakathi kokukhanya nombane ngaphakathi kwi-chip enye.
Iingenelo:
1. Nciphisa ilahleko zonxibelelwano: Ukubeka ii-photon kunye nezixhobo ze-elektroniki kufutshane kunciphisa ilahleko zesignali ezinxulumene nonxibelelwano olungekho kwi-chip.
2, Ukusebenza okuphuculweyo: Ukuhlanganiswa okuqinileyo kunokukhokelela kwisantya sokudluliselwa kwedatha esikhawulezayo ngenxa yeendlela zesignali ezimfutshane kunye nokubambezeleka okunciphileyo.
3, Ubungakanani obuncinci: Ukuhlanganiswa kwe-monolithic kuvumela izixhobo ezincinci kakhulu, nto leyo eluncedo kakhulu kwizicelo ezinqongopheleyo, ezifana namaziko edatha okanye izixhobo eziphathwayo.
4, ukunciphisa ukusetyenziswa kwamandla: susa imfuneko yeepakeji ezahlukeneyo kunye nokunxibelelana okude, okunokunciphisa kakhulu iimfuno zamandla.
Umngeni:
1) Ukuhambelana kwezinto: Ukufumana izinto ezixhasa ii-electron ezikumgangatho ophezulu kunye nemisebenzi ye-photonic kunokuba nzima kuba zihlala zifuna iimpawu ezahlukeneyo.
2, ukuhambelana kwenkqubo: Ukudibanisa iinkqubo ezahlukeneyo zokwenza izinto ze-elektroniki kunye nee-photon kwisiseko esinye ngaphandle kokonakalisa ukusebenza kwento enye ngumsebenzi onzima.
4, Ukwenziwa kwezinto ezintsonkothileyo: Ukuchaneka okuphezulu okufunekayo kwizakhiwo ze-elektroniki kunye ne-photononic kwandisa ubunzima kunye neendleko zokwenziwa.

Ukudibanisa ii-chip ezininzi
Le ndlela ivumela ukuguquguquka okukhulu ekukhetheni izixhobo kunye neenkqubo zomsebenzi ngamnye. Kule ntsebenziswano, izinto ze-elektroniki kunye neze-photonic zivela kwiinkqubo ezahlukeneyo kwaye emva koko zihlanganiswa kunye kwaye zibekwe kwiphakheji okanye kwi-substrate efanayo (Umfanekiso 1). Ngoku masidwelise iindlela zokubopha phakathi kwee-optoelectronic chips. Ukubopha ngokuthe ngqo: Le ndlela ibandakanya ukunxibelelana ngqo ngokomzimba kunye nokubopha kwiindawo ezimbini ezicwangcisiweyo, ngokuqhelekileyo kuncediswa ngamandla okubopha iimolekyuli, ubushushu, kunye noxinzelelo. Inenzuzo yokulula kunye nokudibanisa okunokulahleka okuphantsi kakhulu, kodwa ifuna iindawo ezilungelelaniswe ngokuchanekileyo nezicocekileyo. Ukudibanisa i-fibre/grating: Kule nkqubo, i-fiber okanye i-fiber array ilungelelaniswe kwaye ibotshelelwe kumda okanye kumphezulu we-chip ye-photonic, okuvumela ukukhanya ukuba kudityaniswe ngaphakathi nangaphandle kwe-chip. I-grating ingasetyenziselwa ukuhlanganisa ngokuthe nkqo, ukuphucula ukusebenza kakuhle kokudluliselwa kokukhanya phakathi kwe-chip ye-photonic kunye ne-fiber yangaphandle. I-Through-silicon holes (TSVs) kunye ne-micro-bumps: I-Through-silicon holes zii-connectivity ezithe nkqo nge-substrate ye-silicon, ezivumela ii-chips ukuba zibekwe kwiimilinganiselo ezintathu. Xa zidityaniswe neendawo ezincinci ezijikelezayo, zinceda ekufezekiseni unxibelelwano lombane phakathi kweetships ze-elektroniki kunye neze-photonic kwiindlela ezihlanganisiweyo, ezifanelekileyo ekudityanisweni koxinano oluphezulu. Umaleko we-optical intermediary: Umaleko we-optical intermediary yi-substrate eyahlukileyo equlethe izikhokelo ze-optical waveguides ezisebenza njengomlamli wokuhambisa imiqondiso ye-optical phakathi kweetships. Ivumela ukulungelelaniswa ngokuchanekileyo, kunye ne-passive eyongezelelweyoizinto ezibonakalayoingadibaniswa ukuze kwandiswe ukuguquguquka konxibelelwano. I-hybrid bonding: Le teknoloji yokudibanisa ephucukileyo idibanisa i-direct bonding kunye ne-micro-bump technology ukufezekisa unxibelelwano lombane oluxineneyo phakathi kwee-chips kunye ne-optical interfaces ezikumgangatho ophezulu. Ithembisa ngakumbi kwi-optoelectronic co-integration esebenza kakhulu. I-solder bump bonding: Njenge-flip chip bonding, ii-solder bumps zisetyenziselwa ukwenza unxibelelwano lombane. Nangona kunjalo, kwimeko yokudibanisa i-optoelectronic, kufuneka kunikwe ingqalelo ekhethekileyo ekuphepheni ukonakala kwezinto ze-photonic ezibangelwa kuxinzelelo lobushushu kunye nokugcina ulungelelwaniso lwe-optical.

Umfanekiso 1: : I-Electron/photon chip-to-chip Iskimu sokubopha

Iingenelo zezi ndlela zibalulekile: Njengoko ihlabathi le-CMOS liqhubeka nokulandela uphuculo kwiMoore's Law, kuya kwenzeka ukuba isizukulwana ngasinye se-CMOS okanye i-Bi-CMOS sihlengahlengiswe ngokukhawuleza kwi-chip ye-silicon photonic engabizi, nto leyo evune iingenelo zeenkqubo ezilungileyo kwi-photonics nakwi-electronics. Ngenxa yokuba i-photonics ngokubanzi ayifuni ukwenziwa kwezakhiwo ezincinci kakhulu (ubukhulu obuphambili obumalunga ne-100 nanometers buqhelekile) kwaye izixhobo zinkulu xa kuthelekiswa nee-transistors, izinto eziqwalaselwayo kwezoqoqosho ziya kunyanzela ukuba izixhobo ze-photonic zenziwe kwinkqubo eyahlukileyo, ezahlulwe kuzo naziphi na izixhobo ze-elektroniki eziphambili ezifunekayo kwimveliso yokugqibela.
Iingenelo:
1, ukuguquguquka: Izixhobo kunye neenkqubo ezahlukeneyo zingasetyenziswa ngokuzimeleyo ukuze kufezekiswe ukusebenza ngeyona ndlela ilungileyo kwezinto ze-elektroniki kunye neze-photonic.
2, ukuvuthwa kwenkqubo: ukusetyenziswa kweenkqubo zokuvelisa ezivuthiweyo kwicandelo ngalinye kunokwenza lula imveliso kwaye kunciphise iindleko.
3, Ukuphuculwa nokugcinwa okulula: Ukwahlulwahlulwa kwezixhobo kuvumela ukuba izixhobo ngazinye zitshintshwe okanye ziphuculwe ngokulula ngaphandle kokuchaphazela yonke inkqubo.
Umngeni:
1, ukulahleka konxibelelwano: Unxibelelwano olungekho kwi-chip luzisa ukulahleka kwesiginali eyongezelelweyo kwaye lunokufuna iinkqubo zokulungelelanisa ezintsonkothileyo.
2, ukwanda kobunzima kunye nobukhulu: Izinto ezidityanisiweyo zifuna ukupakisha okongezelelweyo kunye nokunxibelelana, nto leyo ebangela ubungakanani obukhulu kunye neendleko ezinokubakho eziphezulu.
3, ukusetyenziswa kwamandla aphezulu: Iindlela ezinde zesignali kunye nokupakishwa okongeziweyo kunokunyusa iimfuno zamandla xa kuthelekiswa nokuhlanganiswa kwe-monolithic.
Isiphelo:
Ukukhetha phakathi kokuhlanganiswa kwe-monolithic kunye ne-multi-chip kuxhomekeke kwiimfuno ezithile zesicelo, kubandakanya iinjongo zokusebenza, imida yobukhulu, ukuqwalaselwa kweendleko, kunye nokuvuthwa kwetekhnoloji. Nangona ubunzima bokuvelisa, ukuhlanganiswa kwe-monolithic kuluncedo kwizicelo ezifuna ukwenziwa kube lula kakhulu, ukusetyenziswa kwamandla aphantsi, kunye nokudluliselwa kwedatha ngesantya esiphezulu. Endaweni yoko, ukuhlanganiswa kwe-multi-chip kunika ukuguquguquka okukhulu koyilo kwaye kusebenzisa amandla okuvelisa akhoyo, okwenza kube kufanelekile kwizicelo apho ezi zinto zingaphezulu kweenzuzo zokuhlanganiswa okuqinileyo. Njengoko uphando luqhubeka, iindlela ezixutyiweyo ezidibanisa izinto zombini izicwangciso nazo ziyajongwa ukuphucula ukusebenza kwenkqubo ngelixa kunciphisa imingeni enxulumene nendlela nganye.