Ukusebenzisa itekhnoloji ye-optoelectronic co-packaging ukusombulula ukuhanjiswa kwedatha enkulu Icandelo lokuqala

Ukusebenzisai-optoelectronicitekhnoloji yokupakisha ngokubambisana ukusombulula ukuhanjiswa kwedatha okukhulu

Ukuqhutyelwa kuphuhliso lwamandla ekhompyutheni ukuya kwinqanaba eliphezulu, inani ledatha likhula ngokukhawuleza, ngokukodwa i-traffic yeshishini elitsha ledatha njengeemodeli ezinkulu ze-AI kunye nokufunda komatshini kukhuthaza ukukhula kwedatha ukusuka ekupheleni ukuya ekupheleni kunye nabasebenzisi.Idatha enkulu kufuneka idluliselwe ngokukhawuleza kuzo zonke ii-angles, kwaye izinga lokuhanjiswa kwedatha liye laphuhliswa ukusuka kwi-100GbE ukuya kwi-400GbE, okanye nakwi-800GbE, ukuhambelana nokunyuka kwamandla ekhompyutheni kunye neemfuno zokusebenzisana kwedatha.Njengoko amaxabiso omgca anyukile, ubunzima bebhodi yebhodi ye-hardware ehambelanayo iye yanda kakhulu, kwaye i-I / O yendabuko ayikwazanga ukujamelana neemfuno ezahlukeneyo zokuhambisa izibonakaliso zesantya esiphezulu ukusuka kwi-ASics ukuya kwiphaneli yangaphambili.Kulo mongo, i-CPO i-optoelectronic co-packaging ifunwa emva.

Ukusetyenzwa kwedatha kuyenyuka, iCPOi-optoelectronicco-seal ingqalelo

Kwinkqubo yonxibelelwano lwamehlo, imodyuli ye-optical kunye ne-AISC (i-Network switching chip) zipakishwe ngokwahlukeneyo, kwayeimodyuli yokubonaifakwe kwiphaneli yangaphambili yokutshintsha kwimowudi epluggable.Imowudi eplagayo ayingomntu wasemzini, kwaye uninzi lonxibelelwano lwemveli lwe-I/O ludityaniswe kunye kwimowudi eplagayo.Nangona iplagi iselukhetho lokuqala kwindlela yobugcisa, imowudi yokuplaga iveze iingxaki ezithile kumazinga aphezulu edatha, kwaye ubude bonxibelelwano phakathi kwesixhobo sokukhanya kunye nebhodi yesekethe, ilahleko yokuhanjiswa komqondiso, ukusetyenziswa kwamandla, kunye nomgangatho uya kuthintelwa njengoko isantya sokuqhubekeka kwedatha sifuna ukwanda ngakumbi.

Ukuze kulungiswe imiqobo yokunxibelelana kwendabuko, i-CPO optoelectronic co-packaging sele iqalile ukufumana ingqalelo.Kwi-Co-packaged optics, iimodyuli ze-optical kunye ne-AISC (i-Network switching chips) zipakishwe kunye kwaye zixhunywe ngoqhagamshelwano olufutshane lombane, ngaloo ndlela lufezekisa ukuhlanganiswa kwe-compact optoelectronic.Iinzuzo zobukhulu kunye nobunzima obuziswa yi-CPO photoelectric co-packaging ziyabonakala, kwaye i-miniaturization kunye ne-miniaturization yeemodyuli ze-high-speed optical ziyenzeka.Imodyuli ye-optical kunye ne-AISC (i-Network switching chip) iphakathi ebhodini, kwaye ubude befiber bunokuncitshiswa kakhulu, oku kuthetha ukuba ilahleko ngexesha lokudluliselwa lingancitshiswa.

Ngokutsho kwedatha yovavanyo ye-Ayar Labs, i-CPO opto-co-packaging inokunciphisa ngokuthe ngqo ukusetyenziswa kwamandla ngesiqingatha xa kuthelekiswa neemodyuli ezibonakalayo eziplagiweyo.Ngokutsho kwe-Broadcom's calculation, kwi-400G i-pluggable optical module, i-CPO scheme inokugcina malunga ne-50% yokusetyenziswa kwamandla, kwaye xa kuthelekiswa ne-1600G imodyuli ye-pluggable optical, i-CPO scheme inokugcina ukusetyenziswa kwamandla amaninzi.Uyilo olusembindini ngakumbi lukwenza ukuba uqhagamshelo loqhagamshelo lunyuke kakhulu, ukulibaziseka kunye nokugqwethwa komqondiso wombane kuya kuphuculwa, kwaye uthintelo lwesantya sothumelo alusafani nemowudi yesiqhelo yokuplaga.

Enye ingongoma iindleko, ubukrelekrele yanamhlanje yokwenziwa, umncedisi kunye neenkqubo zokutshintsha zifuna ingxinano ephezulu kakhulu kunye nesantya, imfuno yangoku iyanda ngokukhawuleza, ngaphandle kokusetyenziswa kwe-CPO co-packaging, imfuno yenani elikhulu lee-high-end connectors ukudibanisa imodyuli ye-optical, elixabiso elikhulu.I-CPO co-packaging inokunciphisa inani lokudibanisa nayo inxalenye enkulu yokunciphisa i-BOM.I-CPO photoelectric co-packaging yindlela yodwa yokufikelela kwisantya esiphezulu, i-bandwidth ephezulu kunye nenethiwekhi yamandla aphantsi.Le teknoloji yokupakisha amacandelo e-silicon photoelectric kunye namacandelo e-elektroniki kunye yenza imodyuli ye-optical isondele kangangoko kunokwenzeka kwi-chip yenethiwekhi yokutshintsha ukunciphisa ilahleko yeshaneli kunye nokungaqhubeki kwe-impedance, ukuphucula kakhulu ukuxinana koqhagamshelwano kunye nokubonelela ngenkxaso yobugcisa kwizinga eliphezulu loqhagamshelwano lwedatha kwixesha elizayo.