Ubume beunxibelelwano lwamehloimodyuli iyaziswa
Uphuhliso lweunxibelelwano lwamehloitekhnoloji kunye nethekhnoloji yolwazi iyancedisana, kwelinye icala, izixhobo zonxibelelwano zamehlo zithembele kwisakhiwo sokupakisha esichanekileyo ukuphumeza imveliso ephezulu yokuthembeka kwemiqondiso yamehlo, ukuze ubugcisa bokupakisha obuchanekileyo bezixhobo zonxibelelwano lwe-optical buye buyinto ephambili yokuvelisa iteknoloji ukuqinisekisa uphuhliso oluzinzileyo nolukhawulezayo lweshishini lolwazi; Kwelinye icala, uphuhliso oluqhubekayo nophuhliso lwetekhnoloji yolwazi lubeke phambili iimfuno eziphezulu zezixhobo zonxibelelwano lwamehlo: isantya sothumelo olukhawulezayo, izikhombisi zokusebenza eziphezulu, imilinganiselo emincinci, idigri ephezulu yokudityaniswa kwefoto yombane, kunye neteknoloji yokupakisha eyongayo.
Isakhiwo sokupakisha sezixhobo zonxibelelwano lwe-optical yahluka, kwaye ifom yokupakisha eqhelekileyo iboniswe kumzobo ongezantsi. Ngenxa yokuba ulwakhiwo kunye nobukhulu bezixhobo zonxibelelwano ze-optical zincinci kakhulu (i-diameter ye-core ye-fiber ye-single-mode ingaphantsi kwe-10μm), ukuphambuka okuncinci kulo naliphi na icala ngexesha lokudibanisa iphakheji kuya kubangela ilahleko enkulu yokudibanisa. Ke ngoko, ulungelelwaniso lwezixhobo zonxibelelwano lwe-optical kunye neeyunithi ezihambayo ezidityanisiweyo kufuneka zibe nokuchaneka kokubeka okuphezulu. Ngaphambili, isixhobo, esimalunga ne-30cm x 30cm ngobukhulu, siqulunqwe ngamacandelo onxibelelwano lwe-discrete optical kunye ne-digital signal processing (DSP) chips, kwaye senza amacandelo amancinci onxibelelwano optical ngokusebenzisa iteknoloji yenkqubo ye-silicon photonic, kwaye idibanisa iiprosesa zesignali zedijithali ezenziwe nge-7nm inkqubo ephuculweyo yokwenza i-transceivers optical, ukunciphisa kakhulu ukulahlekelwa kwamandla kunye nokunciphisa ubungakanani besixhobo.
I-silicon photonicI-Optical Transceiveryeyona silicon iqolileyoisixhobo sefotookwangoku, kubandakanywa iiprosesa ze-silicon chip zokuthumela kunye nokwamkela, i-silicon photonic edibeneyo ye-chips edibanisa i-semiconductor lasers, i-optical splitters kunye ne-signal modulators (i-Modulator), i-optical sensors kunye ne-fiber couplers kunye nezinye izinto. Ukupakishwa kwi-Pluggable fiber optic connector, isibonakaliso esivela kumncedisi wedatha yedatha inokuguqulwa ibe ngumqondiso we-optical odlula kwifiber.
Ixesha lokuposa: Aug-06-2024