Uphando lwamva nje kwii-laser ze-semiconductor ezinemibala emibini

Uphando lwamva nje kwii-laser ze-semiconductor ezinemibala emibini

I-semiconductor disc lasers (i-SDL lasers), ekwabizwa ngokuba yi-laser yangaphandle ethe nkqo ye-laser-emitting lasers (VECSEL), itsale umdla omkhulu kwiminyaka yakutshanje. Idibanisa iingenelo zokuzuza kwe-semiconductor kunye ne-solid-state resonators. Ayipheleli nje ngokusebenzayo umda wokukhutshwa kwenkxaso yemowudi enye yee-lases ze-semiconductor eziqhelekileyo, kodwa ikwabonisa uyilo oluguquguqukayo lwe-semiconductor bandgap kunye neempawu eziphezulu zokuzuza izinto. Inokubonwa kuluhlu olubanzi lweemeko zesicelo, ezifana nengxolo ephantsilaser-linewidth emxinwaimveliso, i-ultra-short-repetition high-repetition pulse generation, i-high-order harmonic isizukulwana, kunye neteknoloji yeenkwenkwezi ze-sodium, njl.njl. Ngokuqhubela phambili kwethekhnoloji, iimfuno eziphezulu zibekwe phambili ngenxa yokuguquguquka kwe-wavelength. Ngokomzekelo, imithombo yokukhanya edibeneyo yokukhanya okuphindwe kabini ibonise ixabiso eliphezulu kakhulu lesicelo kwiindawo ezivelayo ezifana ne-anti-interference lidar, i-holographic interferometry, i-wavelength division multiplexing communication, i-middle-infrared okanye i-terahertz isizukulwana, kunye ne-multi-color optical frequency cobs. Ukufumana njani ukugqama okuphezulu kokukhutshwa kombala omibini kwi-semiconductor disc lasers kunye nokucinezela ngokufanelekileyo ukhuphiswano lokufumana ukhuphiswano phakathi kwamaza amaza amaninzi bekusoloko kungubunzima bophando kule ndawo.

Kutshanje, umbala ombinisemiconductor laseriqela eTshayina licebise uyilo lwetshiphu entsha ukujongana nalo mngeni. Ngophando lwamanani olunzulu, bafumanise ukuba ukulawula ngokuchanekileyo ubungakanani obunxulumene nobushushu bufumana ukuhluzwa kunye neziphumo zokucoca i-semiconductor microcavity kulindeleke ukuba kufezekiswe ulawulo oluguquguqukayo lwenzuzo yemibala emibini. Ngokusekwe koku, iqela liyile ngempumelelo i-chip ye-960/1000 nm yokukhanya okuphezulu. Le laser isebenza kwimowudi esisiseko kufutshane nomda we-diffraction, kunye nokukhanya okuphumayo okungaphezulu malunga ne-310 MW/cm²sr.

Umaleko wokuzuza wediski ye-semiconductor ziimicrometers ezimbalwa kuphela ubukhulu, kwaye i-Fabry-Perot microcavity yenziwe phakathi kwe-interface ye-semiconductor-air kunye ne-bottom esasazwayo ye-Bragg reflector. Ukunyanga i-semiconductor microcavity njengesihluzo se-spectral esakhelwe ngaphakathi se-chip siya kulungelelanisa inzuzo ye-quantum kakuhle. Ngeli xesha, impembelelo yokucoca i-microcavity kunye nenzuzo ye-semiconductor inamazinga ahlukeneyo obushushu bokuhamba. Ukudibanisa nokulawula ukushisa, ukutshintshwa kunye nokulawulwa kwe-output wavelengths kunokufezekiswa. Ngokusekelwe kwezi mpawu, iqela libalwe kwaye labeka i-peak yokuzuza kwi-quantum kakuhle kwi-950 nm kwi-300 K ubushushu, kunye nesantya sokukhukuliseka kweqondo lokufumana i-wavelength malunga ne-0.37 nm / K. Emva koko, iqela liye layila i-longitudinal constrict factor ye-chip kusetyenziswa indlela ye-matrix yothumelo, kunye nencopho yamaza amalunga ne-960 nm kunye ne-1000 nm ngokulandelelanayo. Ukulinganisa kubonise ukuba izinga lobushushu lokukhukuliseka laliyi-0.08 nm/K kuphela. Ngokusebenzisa itekhnoloji yokubeka itekhnoloji yesinyithi-ephilayo yeekhemikhali zomphunga wokukhula kwe-epitaxial kunye nokuphucula ngokuqhubekayo inkqubo yokukhula, iichips ezikumgangatho ophezulu zenziwa ngempumelelo. Iziphumo zokulinganisa ze-photoluminescence zihambelana ngokupheleleyo neziphumo zokulinganisa. Ukunciphisa umthwalo we-thermal kunye nokufezekisa ukuhanjiswa kwamandla aphezulu, inkqubo yokupakisha i-semiconductor-diamond chip iye yaphuhliswa ngakumbi.

Emva kokugqiba ukupakishwa kwe-chip, iqela lenze uhlolo olubanzi malunga nokusebenza kwayo kwe-laser. Kwimo yokusebenza eqhubekayo, ngokulawula amandla epompo okanye ukushisa kweqondo lokushisa, ubude be-wavelength bunokulungelelaniswa ngokuguquguqukayo phakathi kwe-960 nm kunye ne-1000 nm. Xa amandla epompo engaphakathi kuluhlu oluthile, i-laser inokuphinda ifezekise i-double-wavelength operation, kunye ne-interval ye-wavelength ukuya kwi-39.4 nm. Ngeli xesha, awona mandla aphezulu aqhubekayo amaza afikelela kwi-3.8 W. Okwangoku, i-laser isebenza kwimowudi esisiseko kufutshane nomda we-diffraction, kunye ne-beam yomgangatho we-M² we-1.1 kuphela kunye nokukhanya okuphezulu malunga ne-310 MW / cm²sr. Iqela liphinde lenze uphando malunga nokusebenza kwamaza okulinganayo kwelaser. Isiginali ye-frequency yabonwa ngempumelelo ngokufaka i-crystal ye-LiB₃O₅ engabonakaliyo kwi-crystal ye-optical kwi-cavity ye-resonant, eqinisekisa ukulungelelaniswa kwamaza amabini.

Ngolu yilo lwetshiphu lukrelekrele, indibaniselwano ye-organic yokuhluzwa kakuhle kwe-quantum kunye nokuhluzwa kwe-microcavity kuye kwaphunyezwa, kubeka isiseko soyilo sofezekiso lwemithombo yelaser enemibala emibini. Ngokubhekiselele kwizalathisi zokusebenza, le laser ye-single-chip-double-color laser ifezekisa ukukhanya okuphezulu, ukuguquguquka okuphezulu kunye nokukhutshwa okuchanekileyo kwe-coaxial beam. Ukukhanya kwayo kukwinqanaba eliphambili lamazwe ngamazwe kwintsimi yangoku ye-single-chip dual-color semiconductor lasers. Ngokubhekiselele kwisicelo esisebenzayo, le mpumelelo ilindeleke ukuba iphucule ngokufanelekileyo ukuchaneka kokuchongwa kunye nokukwazi ukuchasana nokuphazamiseka kwe-lidar yemibala emininzi kwiindawo eziyinkimbinkimbi ngokugxininisa ukukhanya kwayo okuphezulu kunye neempawu ezinemibala emibini. Kwintsimi yee-combs ze-optical frequency, imveliso yayo ezinzileyo ye-double-wavelength inokubonelela ngenkxaso ebalulekileyo kwizicelo ezifana nomlinganiselo ochanekileyo we-spectral kunye ne-high-resolution sensing ye-optical sensing.