I-SISilicon Phosa esebenzayo

I-SISilicon Phosa esebenzayo

Izinto ze-Photonics ezisebenzayo zibhekisa ngokuthe ngqo ukuze kudityaniswe ngabom phakathi kokukhanya kunye nomba. Icandelo eliqhelekileyo elisebenzayo le-Photonics yimodyuli ye-Optical. Zonke izinto ezikhoyo zeSiliconIimodyuli ze-Opticalzisekwe kwiPlasma yasimahla yePlasma. Ukutshintsha inani le-elektroni kunye nemingxunya yasimahla kwi-selicon yezinto ezihambayo, iindlela zombane okanye iindlela ezihamba phambili zinokutshintsha i-index ye-ficketion, inkqubo eboniswe yidatha eyi-1550. Xa kuthelekiswa ne-elektroni, imingxunya ibangela ukuba inani le-Index le-Real kunye neNgcaciso yeNgeniso, oko kukuthi, banokuvelisa utshintsho lwesigaba senqanaba lokulahleka, kunjaloImodyuli ye-Mach-Zehunderkunye neemodyuli ze-ring, zihlala zikhetha ukusebenzisa imingxunya ukwenzaIimodyuli zesigaba.

EzahlukeneyoI-selicon (i-SI) ye-modulatorIindidi zibonisiwe kuMfanekiso 10A. Kwi-Inaction Inaliti ye-Podurict modulator, ukukhanya kubekwe e-Intrinsic Silicon kwiPinki enkulu kakhulu, kunye nee-elektroni kunye nemingxunya kunye nemingxunya zitotshwa. Nangona kunjalo, ezo modulikela zihamba kancinci, zihlala zine-bandwidth ye-500 MHZ, kuba ii-elektroni kunye nemingxunya kunye nemingxunya kunye nemingxunya zithatha ixesha elide ukuba ziphinde ziphinde ziphinde zenzeke emva kwenaliti. Ke ngoko, le sakhiwo ihlala isetyenziswa njenge-Anteticator eyahlukileyo (VOA) endaweni yemodyuli. Kwimodyuli yokuthambisa i-carrier, inxalenye yokukhanya ibekwe kwindawo emxinwa ye-PN, kwaye ububanzi obugcwele bomdibaniso we-PN lutshintshwe yindawo yombane osetyenzisiweyo. Lo mthambo unokusebenza ngesantya esingaphezulu kwe-50GB / s, kodwa unelahleko yokufakelwa imvelaphi ephezulu. I-VPIL eqhelekileyo yi-2 v-cm. I-oxiomuonductor yentsimbi yentsimbi (i-mos) (eneneni) (ngenene) Ivumela ukuqokelelwa kokuqulwa kwenkathalo kunye nokupheliswa kwenkathalo, ukuvumela i-v v v v v v v v v v v v v v v v v v v ukwe-0,2 v-cm, kodwa inezinto ezinqabileyo zokulahleka okuphezulu kunye ne-offitication ephezulu yeyunithi ubude. Ukongeza, kukho iimodyuli ze-theil zokuthambisa zombane ezisekwe kwi-chie (i-Silicon Allow Allow) Ibhendi yebhendi. Ukongeza, kukho iimodyuli ze-Graphene ezixhomekeke kwi-Graphene yokutshintsha phakathi kwentsimbi ebonakalayo kunye nezixhobo ezibonakalayo. Oku kubonisa ukwahluka kwezicelo zendlela eyahlukeneyo ukufezekisa isantya esiphezulu, ukulahleka kwelahleko esezantsi.

Umzobo we-10: (a) Umzobo onqamlezileyo wecandelo le-silicon esekwe kwimodyuli eyahlukeneyo yeMongoli yeMpuzi kunye (b) kunye (b) nemizobo yecandelo lecandelo lamacandelo otshintshileyo.

Iqela lokufumana isibane esiliqela liboniswe kumzobo 10B. Izinto ezibonakalayo yi-Gezeriaum (GE). I-GE iyakwazi ukufumanisa ukukhanya kwi-wavelengled ukuba malunga ne-1.6 microns. Iboniswe ngasekhohlo yeyona nto iphumelele i-PIN ye-PIN. Iqulathe uhlobo lwe-p I-GE kwaye u-Sismattice mismatch, kwaye ukuze unciphise i-dislocation, umaleko omdaka we-suge uqale ukhule kuqala njengobulalo lwe-buffer. Uhlobo lwe-N-uhlobo lwenziwa ngaphezulu kwe-geier. Isinyithi-semiconductor-inyibiliki (i-MSM) I-Photodiode iboniswe phakathi, kunye ne-APD (I-Avalanche Pempletetect) Iboniswa ngasekunene. Ingingqi ye-Avalanche kwi-APD ifumaneka e-Si, enezimpawu ezisezantsi ezithelekiswa nengingqi ye-Avalanche kwiQela III-v-v.

Okwangoku, akukho zisombululo zinezibonelelo ezibonakalayo ekuhlanganiseni inzuzo ye-silicon. Umzobo 11 ubonakalisa iindlela ezinokubakho ezilungiselelwe linqanaba lendibano. Ukude kubekho ngasekhohlo yimidibaniso ye-monolithic ebandakanya ukusetyenziswa kwe-jamanium ekhulayo e-Getaxic (GEBIU) njenge-pumerical toulgaides (efana ne-al2im ye-typgaim ye-getaxide). Ikholamu elandelayo ifele kwindibano ye-wafer, ebandakanya i-oxdide kunye ne-organic gossing kwingingqi yeqela le-III. Ikholamu elandelayo yindibano ye-chip-to-wafer, ebandakanya ukungena kwiqela le-III ye-III-v kwi-Chip ye-Chip kwi-Cavicon Wafer kwaye emva koko yoma ophulayo kwisakhiwo se-waveguide. Uncedo lwale ndlela yokuqala yekholamu kukuba isixhobo sinokusebenza ngokupheleleyo ngaphakathi kwi-wafer ngaphambi kokusika. Ikholamu yekholamu elungileyo ye-chip-to-chip, kubandakanya ne-coupling ngqo ye-silicon chips ukuya kwi-Chips ye-III-v ye-chips yeqela, kunye ne-coupling nge-lens kunye nabatshati abatshatileyo. Imeko ekubhekiswa kuyo izicelo zentengiso ihamba ukusuka ngasekunene ukuya kwicala lasekhohlo letshathi ukuya kwizisombululo ezihlanganisiweyo nezihlanganisiweyo.

Umzobo 11: Inzuzo yamaphenyane idityaniswe njani kwi-FILINICS. Njengoko usiya ukusuka ngasekhohlo uye ekunene, inqaku lokufakelwa kwemveliso ihamba ibuyela kwinkqubo.