Indlela yokudityaniswa kwe-Optoect

I-optoectronicIndlela yokudibanisa

Ukudityaniswa kweIphepheniKwaye i-elektroniki linyathelo eliphambili ekuphuculeni amandla eenkqubo zokulungisa iinkcukacha, ukuvumela amaxabiso okudluliselwa kwedatha ngokukhawuleza, ukusebenzisa amandla asezantsi kunye nokuvula amanye amathuba e-compact, kunye nokuvula amathuba amakhulu okuyila. Iindlela zokudibanisa zahlulahlulwe zangamacandelo amabini: Ukudityaniswa kwe-monolithic kunye nokudityaniswa kwe-chip ezininzi.

Umdibaniso we-monolikic
Ukudityaniswa kwe-monolithic kubandakanya ukwenza izinto ezenza izinto ze-Photonic kunye ne-elektroniki kwicandelo elifanayo, zihlala zisebenzisa izixhobo kunye neenkqubo ezihambelana nayo. Le ndlela igxile ekwenzeni indlela yokunxibelelana engenamthungo phakathi kokukhanya kunye nombane ngaphakathi kwe-chip enye.
Izibonelelo:
1. Ukunciphisa ilahleko yokunxibelelana: Ukubeka imifanekiso kunye nezinto ze-elektroniki kunye nezinto ze-elektroniki ekusondeleni kwelahleko yokulahleka kwe-chip.
2, Ukuphuculwa kwentsebenzo: Ukudityaniswa kobuchule kunokukhokelela kwizantya zokudlulisela idatha ngokukhawuleza ngenxa yeendlela zomqondiso ezimfutshane kwaye unciphise i-tencle.
3, ubungakanani obuncinci: Ukudityaniswa kwe-monolithic kuvumela izixhobo zecompact ezikhulu, eziyingenelo ikakhulu kwizicelo zendawo, ezinje ngamaziko edatha okanye izixhobo eziphathwayo.
4, Ukucutha ukusetyenziswa kwamandla: Ukuphelisa isidingo seephakeji ezahlukeneyo kunye neendlela zonxibelelwano ezinde, ezinokunciphisa kakhulu iimfuno zombane.
Umngeni:
1) Ukufezekiswa kwezinto: Ukufumana izixhobo ezixhasa zombini imisebenzi ekumgangatho ophezulu kunye nemisebenzi yesifomatics kunokuba ngumngeni kuba zihlala zifuna iipropathi ezahlukeneyo.
2, Ukudityaniswa kwenkqubo: Ukudibanisa iinkqubo zemveliso eyahlukeneyo ye-elektroniki kunye neefoto kwi-subser efanayo ngaphandle kokuhlazisa ukusebenza kwalo naliphi na icandelo elinye ngumsebenzi onzima.
4, UMQULU WOKUGQIBELA

Ukudityaniswa kwe-chip ezininzi
Le ndlela ivumela ukuba bhetyebhetye ngakumbi ekukhetheni izixhobo kunye neenkqubo zomsebenzi ngamnye. Kule Nuxule, izinto ze-elektroniki kunye ne-Elektonic zivela kwiinkqubo ezahlukeneyo kwaye emva koko zidityaniswe kunye kwaye zibekwe kwiphakheji enye okanye i-subtate (umzobo 1). Ngoku makhe sidwelise iimodeli ze-boing phakathi kweetshiphu ze-optoect. I-Boung ngokuthe ngqo: Obu buchule bubandakanya ukunxibelelana ngqo ngokwasemzimbeni kunye nokugqobhoza kwendawo ezimbini zeplani, zihlala ziququzelelwa ngumkhosi wokuxhotyiswa kwemolekyuli, ubushushu, kunye noxinzelelo. Inenzuzo yokulula kunye nokudityaniswa okunokubakho kwelahleko kakhulu, kodwa kufuna indawo ehambelana ngqo neyococekileyo. I-fiber / yokulungiselela ukudibanisa: kwesi sikimu, i-fiber okanye i-fiber okanye uluhlu lwe-fiber lilungelelaniswe kwaye lugqunywe kumda okanye umphezulu we-phetonic chip, uvumele ukukhanya ngaphakathi nangaphandle kweChip. Uhlobo olunokusetyenziselwa ukudibanisa ngokuthe nkqo, ukuphucula ukusebenza kwempumelelo kosulelo phakathi kwe-phetonic chip kunye nefayibha yangaphandle. Ukusebenzisa-imingxunya ye-silicon (i-TSvs) kunye nee-micro-cumps: Imingxunya ye-Silicon inxibelelana ngokuthe nkqo ngokusebenzisa i-silicon Fricecade, ivumela i-chips ibekwe kwimilinganiselo emithathu. Zidityaniswe namanqaku amancinci e-microvex, banceda ukufezekisa unxibelelwano lombane phakathi kwe-elektroniki kunye ne-Potoniic chips ekufundiseni okubekiweyo, kufanelekile ukudityaniswa okungaphezulu. I-familical bamber Ivumela ulungelelwaniso oluchanekileyo, kunye nokudlulisela okuqinisekileyoizinto zamehloinokudityaniswa ukwanda konxibelelwano. I-Hybrid Bow: Itekhnoloji ye-Adval idibene netekhnoloji ye-bonding kunye ne-Micro-Bump ye-Micro-Bump yokufezekisa unxibelelwano lombane ophezulu phakathi kwe-chips kunye ne-chies ekumgangatho ophezulu. Kukwanqabela ikakhulu ukudityaniswa okungaphezulu kwe-optoectronitive. I-bimp ye-Bhukungqwa: Iyafana ne-Flip Chip, imingxunya yomthengisi isetyenziselwa ukwenza uqhagamshelo lombane. Nangona kunjalo, kwimeko yomdibaniso we-Optoection, kufuneka kuthathelwe ingqalelo ekhethekileyo ukuthintela ukonakaliswa kwezakhiwo ze-Photonic ezibangelwa luxinzelelo lwe-thermal kunye nokugcina ulungelelwaniso.

Umzobo 1:: I-Electron / i-Elenmon / i-Photon ye-chip-to-chip

Izibonelelo zezi ndlela zibalulekile: Njengoko umhlaba we-CMOS uyaqhubeka nokulandela ukuphuculwa komthetho kaMoore, kuya kuba nakho ukutshintsha i-CMOS kwisizukulwana esinexabiso eliphantsi, ukuvuna izibonelelo ze-FOMOICs kunye ne-elektroniki. Kuba i-phetotonics ngokubanzi ayifuni ukuthandwa kwamacandelo amancinci kakhulu (ubungakanani obuphambili malunga ne-100Nanometers) kunye nezixhobo zininzi xa kuthelekiswa nenkqubo eyahlukileyo, ekwahlulwe kuyo nayiphi na imveliso ephambili efunekayo kwimveliso yokugqibela.
Izibonelelo:
1, Ukuguquguquka: Izixhobo ezahlukeneyo kunye neenkqubo zingasetyenziswa ngokuzimeleyo ukufezekisa eyona ntsebenzo ilungileyo ye-elektroniki kunye nezinto ze-Photonic.
2, Qhubekisa ukukhula: Ukusetyenziswa kweenkqubo zokwenza imveliso ezivuthiweyo zecandelo ngalinye kunokwenza lula ukuvelisa kunye nokunciphisa iindleko.
3, Ukuphuculwa ngokulula kunye nolondolozo: Ukwahlulahlulahlulahlulahlulahlulahlulahlulahlulahlulahlulo ukuba kuthathelwe indawo okanye ukuphuculwa ngokulula ngaphandle kokuchaphazela yonke inkqubo.
Umngeni:
1, Ukulahleka konxibelelwano
2, Ukwanda kobungakanani kunye nobungakanani: izinto ezizezodwa zifuna ukupakishwa kunye neenkcazo ezongezelelweyo, ezikhokelela kubungakanani obukhulu kunye neendleko ezinokubakho.
3, Ukusetyenziswa kwamandla okuphezulu: iindlela ezinesiginali kunye nokupakishwa kongezelelweyo kunokunyusa iimfuno zamandla xa kuthelekiswa nokudityaniswa kwe-monolijic.
ISIQINISEKISO:
Ukukhetha phakathi kokudityaniswa kwe-monolithic kunye ne-chili-chia-chia-chie-iinjongo zomsebenzi, iingxaki zexabiso, ukuqondwa kweendleko, kunye nokuqola kwexabiso. Ngaphandle kokwenza ubugqwetha, ukudityaniswa kwe-monolithic kuluncedo kwizicelo ezifuna ukusetyenziswa kwe-mineatherization egqithileyo, ukusetyenziswa kwamandla aphantsi, kunye nokusasazeka kwedatha ephezulu. Endaweni yoko, ukudityaniswa kwe-chip ezininzi kubonelela ngokutshintsha okukhulu kwaye kusebenzise amandla akho okhoyo, okwenza ilungele ukusetyenziswa kwezicelo apho ezi zinto zingaphezulu kwezibonelelo zokudibanisa ukuqina. Njengoko uphando luqhubela phambili, iindlela ze-hybrid ezidibanisa izinto zombini zinokuphononongwa ukuba zenze inkqubo yokusebenza kwenkqubo ngelixa inciphisa imiceli mngeni enxulumene nendlela nganye.