Indlela yokudibanisa i-Optoelectronic

I-Optoelectronicindlela yokudibanisa

Ukudityaniswa kweiifotonicskunye ne-electronics linyathelo eliphambili ekuphuculeni amandla eenkqubo zokucwangcisa ulwazi, ukunika amandla amazinga ogqithiso lwedatha ngokukhawuleza, ukusetyenziswa kwamandla aphantsi kunye noyilo lwezixhobo ezihlangeneyo, kunye nokuvula amathuba amakhulu amatsha oyilo lwenkqubo. Iindlela zokudibanisa ngokubanzi zihlulwe zibe ngamacandelo amabini: ukuhlanganiswa kwe-monolithic kunye nokuhlanganiswa kwe-multi-chip.

Ukuhlanganiswa kwe-Monolithic
Ukuhlanganiswa kwe-monolithic kubandakanya ukuvelisa i-photonic kunye ne-electronic components kwi-substrate efanayo, ngokuqhelekileyo isebenzisa izinto ezihambelanayo kunye neenkqubo. Le ndlela igxile ekudaleni ujongano olungenamthungo phakathi kokukhanya kunye nombane ngaphakathi kwetshiphu enye.
Izinto eziluncedo:
1. Nciphisa ilahleko yonxibelelwano: Ukubeka iifotoni kunye namacandelo e-elektroniki kwindawo ekufutshane kunciphisa ilahleko yeempawu ezinxulumene noqhagamshelo lwe-off-chip.
I-2, ukusebenza okuphuculweyo: Ukuhlanganiswa okuqinileyo kunokukhokelela kwisantya sokudlulisa idatha ngokukhawuleza ngenxa yeendlela ezimfutshane zesignali kunye nokunciphisa i-latency.
I-3, Ubungakanani obuncinci: Ukuhlanganiswa kwe-Monolithic kuvumela izixhobo ezixutywe kakhulu, eziluncedo ngokukhethekileyo kwizicelo ezinomlinganiselo wendawo, njengamaziko edatha okanye izixhobo eziphathwayo.
I-4, ukunciphisa ukusetyenziswa kwamandla: ukuphelisa imfuno yeepakethe ezahlukeneyo kunye nokudibanisa okude, okunokunciphisa kakhulu iimfuno zamandla.
Umngeni:
I-1) Ukuhambelana kwezinto: Ukufumana izinto ezixhasa zombini ii-electron ezikumgangatho ophezulu kunye nemisebenzi ye-photonic ingaba ngumngeni kuba zihlala zifuna iipropati ezahlukeneyo.
I-2, ukuhambelana kwenkqubo: Ukudibanisa iinkqubo ezahlukeneyo zokuvelisa i-electronics kunye neefotoni kwi-substrate efanayo ngaphandle kokuthobisa ukusebenza kweyiphi na inxalenye ngumsebenzi onzima.
I-4, Imveliso eyinkimbinkimbi: Ukuchaneka okuphezulu okufunekayo kwizakhiwo ze-elektroniki kunye ne-photononic kwandisa ubunzima kunye neendleko zokuvelisa.

Ukuhlanganiswa kweetshiphu ezininzi
Le ndlela ivumela ukuguquguquka okukhulu ekukhetheni izixhobo kunye neenkqubo zomsebenzi ngamnye. Kolu kuhlanganiswa, amacandelo e-elektroniki kunye ne-photonic avela kwiinkqubo ezahlukeneyo kwaye emva koko ahlanganiswe kunye kwaye abekwe kwiphakheji eqhelekileyo okanye i-substrate (Umfanekiso 1). Ngoku makhe dwelise iindlela zokudibanisa phakathi kweetshiphusi ze-optoelectronic. Ukudibanisa ngokuthe ngqo: Obu buchule bubandakanya ukudibana ngokuthe ngqo ngokomzimba kunye nokudityaniswa kwemiphezulu emibini ecwangcisiweyo, edla ngokuququzelelwa ngamandla okudibanisa imolekyuli, ubushushu, kunye noxinzelelo. Ine-advanteji yokulula kunye noqhagamshelo oluphantsi kakhulu lwelahleko, kodwa ifuna imiphezulu elungelelaniswe ngokuchanekileyo necocekileyo. I-Fiber / i-grating coupling: Kule ngqungquthela, i-fiber okanye i-fiber array ihambelana kwaye idibene nomda okanye ngaphezulu kwe-photonic chip, evumela ukukhanya ukuba kuhlanganiswe kunye nokuphuma kwi-chip. I-grating ingasetyenziselwa ukudibanisa ngokuthe nkqo, ukuphucula ukusebenza kakuhle kokuhanjiswa kokukhanya phakathi kwe-photonic chip kunye nefiber yangaphandle. Ngemingxuma ye-silicon (i-TSVs) kunye ne-micro-bumps: Imingxuma ye-silicon idibanisa ngokuthe nkqo nge-silicon substrate, evumela iichips ukuba zifakwe kwimilinganiselo emithathu. Ngokudityaniswa namanqaku e-micro-convex, anceda ukufezekisa uxhulumaniso lombane phakathi kwe-electronic chips kunye ne-photonic chips kwi-stacked configurations, ezifanelekileyo ukuhlanganiswa koxinzelelo oluphezulu. Umaleko we-Optical intermediary: Umaleko we-optical intermediary yi-substrate eyahlukileyo equlethe i-optical waveguides esebenza njengomlamli wokuhambisa imiqondiso yokubona phakathi kweetships. Ivumela ulungelelwaniso oluchanekileyo, kunye ne-passive eyongezelelweyoamalungu opticalinokudityaniswa ukonyuka koqhagamshelo bhetyebhetye. I-Hybrid bonding: Le teknoloji ye-bonding ephezulu idibanisa i-teknoloji yokudibanisa ngokuthe ngqo kunye ne-micro-bump iteknoloji ukufezekisa ukudibanisa kombane ophezulu phakathi kwee-chips kunye ne-optical interfaces ezikumgangatho ophezulu. Ithembisa ngokukodwa ukuhlanganiswa kwe-optoelectronic ephezulu yokusebenza. I-Solder bump bonding: Ngokufanayo ne-flip chip bonding, iziqhuma ze-solder zisetyenziselwa ukudala ukudibanisa kombane. Nangona kunjalo, kumxholo wokuhlanganiswa kwe-optoelectronic, ingqwalasela ekhethekileyo kufuneka ihlawulwe ukuphepha umonakalo kumacandelo e-photonic obangelwa uxinzelelo lwe-thermal kunye nokugcina ukulungelelaniswa kwe-optical.

Umzobo 1: : Electron / photon chip-to-chip Bonding scheme

Iingenelo zezi ndlela zibalulekile: Njengoko ihlabathi le-CMOS liqhubeka nokulandela ukuphuculwa koMthetho kaMoore, kuya kwenzeka ukulungelelanisa ngokukhawuleza isizukulwana ngasinye se-CMOS okanye i-Bi-CMOS kwi-silicon photonic chip enexabiso eliphantsi, ivuna izibonelelo zezona nkqubo zingcono kakhulu. photonics kunye ne-elektroniki. Ngenxa yokuba ii-photonics ngokubanzi azifuni ukwenziwa kwezakhiwo ezincinci kakhulu (ubungakanani obuziintloko ezimalunga ne-100 nanometers ziqhelekile) kwaye izixhobo zikhulu xa kuthelekiswa neetransistors, uqwalaselo lwezoqoqosho luya kuthanda ukutyhala izixhobo zefoto ukuba zenziwe ngendlela eyahlukileyo, zahlulwe kuyo nayiphi na imeko ephambili. i-elektroniki efunekayo kwimveliso yokugqibela.
Izinto eziluncedo:
I-1, ukuguquguquka: Izinto ezahlukeneyo kunye neenkqubo zingasetyenziselwa ngokuzimeleyo ukufezekisa ukusebenza kakuhle kwezinto ze-elektroniki kunye ne-photonic.
I-2, ukukhula kwenkqubo: ukusetyenziswa kweenkqubo zokuvelisa ezivuthiweyo kwicandelo ngalinye kunokwenza lula ukuveliswa kunye nokunciphisa iindleko.
I-3, Ukuphuculwa okulula kunye nokugcinwa: Ukwahlulwa kwamacandelo kuvumela ukuba amacandelo ahlukeneyo atshintshwe okanye aphuculwe ngokulula ngaphandle kokuchaphazela yonke inkqubo.
Umngeni:
I-1, ilahleko ye-interconnection: Uxhulumaniso lwe-off-chip luzisa ilahleko eyongezelelweyo yesignali kwaye inokufuna iinkqubo ezinzima zokulungelelanisa.
I-2, ukwanda kobunzima kunye nobukhulu: Amacandelo ngamnye afuna ukupakishwa okongeziweyo kunye nokudibanisa, okubangelwa ubungakanani obukhulu kunye neendleko ezinokuthi zibe phezulu.
I-3, ukusetyenziswa kwamandla aphezulu: Iindlela zesignali ezide kunye nokupakishwa okongeziweyo kunokunyusa iimfuno zamandla xa kuthelekiswa nokuhlanganiswa kwe-monolithic.
Isiphelo:
Ukukhetha phakathi kwe-monolithic kunye ne-multi-chip indibaniselwano kuxhomekeke kwiimfuno ezikhethekileyo zesicelo, kubandakanywa iinjongo zokusebenza, ukunyanzeliswa kobukhulu, ukuqwalaselwa kweendleko, kunye nokuvuthwa kweteknoloji. Ngaphandle kobunzima bokuvelisa, ukuhlanganiswa kwe-monolithic kunenzuzo kwizicelo ezifuna i-miniaturization egqithisileyo, ukusetyenziswa kwamandla aphantsi, kunye nokuhanjiswa kwedatha ngesantya esiphezulu. Endaweni yoko, ukudityaniswa kwee-chip ezininzi kunikezela ukuguquguquka okukhulu koyilo kwaye kusebenzisa ubunakho bokuvelisa obukhoyo, buyenza ilungele usetyenziso apho ezi zinto zingaphezulu kweenzuzo zokudityaniswa okungqongqo. Njengoko uphando luqhubela phambili, iindlela ezixubeneyo ezidibanisa izinto zozibini zobuchule nazo ziyaphononongwa ukuze kuphuculwe ukusebenza kwenkqubo ngelixa kuthotywa imingeni ehambelana nendlela nganye.