Ukuzivelela kunye nenkqubela phambili yeCPO optoelectronic co-packaging technology Icandelo lesibini

Ukuzivelela kunye nenkqubela phambili yeCPOi-optoelectroniciteknoloji yokupakisha ngokubambisana

I-Optoelectronic co-packaging ayiyona itekhnoloji entsha, uphuhliso lwayo lunokulandelwa emva kweminyaka yoo-1960, kodwa ngeli xesha, ukupakishwa kweefoto zombane kuyipakethe nje elulaizixhobo ze-optoelectronickunye. Ngeminyaka yee-1990, ngokunyuka kweimodyuli yonxibelelwano lwamehloishishini, i-copackaging ye-photoelectric yaqala ukuvela. Ngokuvuthelwa kwamandla aphezulu ekhompyuter kunye nemfuno ephezulu ye-bandwidth kulo nyaka, i-photoelectric co-packaging, kunye ne-teknoloji yesebe ehambelana nayo, iphinde yafumana ingqwalasela eninzi.
Kuphuhliso lwethekhnoloji, isigaba ngasinye sineendlela ezahlukeneyo, ukusuka kwi-2.5D CPO ehambelana nemfuno ye-20 / 50Tb / s, ukuya kwi-2.5D Chiplet CPO ehambelana nemfuno ye-50 / 100Tb / s, kwaye ekugqibeleni iqonde i-3D CPO ehambelana ne-100Tb / s. izinga.

Iiphakheji ze-CPO ze-2.5Dimodyuli yokubonakunye ne-network switch chip kwi-substrate efanayo ukunciphisa umgama womgca kunye nokwandisa ubuninzi be-I / O, kunye ne-3D CPO idibanisa ngokuthe ngqo i-IC optical kwi-intermediary layer ukufezekisa ukudibanisa kwe-I / O pitch engaphantsi kwe-50um. Injongo yokuziphendukela kwayo icace kakhulu, oko kukunciphisa umgama phakathi kwemodyuli yokuguqula i-photoelectric kunye ne-network switching chip kangangoko kunokwenzeka.
Okwangoku, i-CPO isebuncinaneni bayo, kwaye kusekho iingxaki ezifana nesivuno esiphantsi kunye neendleko eziphezulu zokugcinwa, kwaye abavelisi abambalwa kwimarike banokubonelela ngokupheleleyo ngeemveliso ezinxulumene neCPO. Kuphela iBroadcom, iMarvell, i-Intel, kunye neqaqobana labanye abadlali abanezisombululo zobunini ngokupheleleyo kwimarike.
UMarvell wazisa iteknoloji ye-2.5D CPO switch usebenzisa inkqubo ye-VIA-LAST kunyaka ophelileyo. Emva kokuba i-silicon ye-optical chip isetyenzisiwe, i-TSV icutshungulwa ngokukwazi ukusetyenzwa kwe-OSAT, kwaye ke i-chip flip-chip yombane yongezwa kwi-silicon optical chip. Iimodyuli ze-16 ze-optical kunye ne-chip yokutshintsha i-Marvell Teralynx7 idityaniswe kwi-PCB ukwenza utshintsho, olunokufikelela kwizinga lokutshintsha kwe-12.8Tbps.

Kwi-OFC yalo nyaka, i-Broadcom kunye noMarvell babonise isizukulwana samva nje se-51.2Tbps switch chips usebenzisa itekhnoloji yokupakisha ye-optoelectronic.
Ukususela kwisizukulwana samva nje se-Broadcom yeenkcukacha zobuchwepheshe be-CPO, iphakheji ye-CPO 3D ngokuphuculwa kwenkqubo yokufezekisa ubuninzi be-I / O, ukusetyenziswa kwamandla e-CPO ukuya kwi-5.5W / 800G, umlinganiselo wokusebenza kwamandla kukusebenza kakuhle kakhulu kuhle kakhulu. Ngexesha elifanayo, i-Broadcom iphinda iphule kwi-wave enye ye-200Gbps kunye ne-102.4T CPO.
I-Cisco iye yandisa utyalo-mali kwi-teknoloji ye-CPO, kwaye yenza umboniso wemveliso ye-CPO kwi-OFC yalo nyaka, ibonisa ukuqokelela kwayo iteknoloji ye-CPO kunye nesicelo kwi-multiplexer / demultiplexer edibeneyo. UCisco uthe uya kuqhuba ukuhanjiswa kwe-CPO kwi-51.2Tb switch, elandelwa kukwamkelwa okukhulu kwimijikelezo yokutshintsha ye-102.4Tb.
I-Intel kudala yazisa utshintsho olusekwe kwi-CPO, kwaye kwiminyaka yakutshanje i-Intel iye yaqhubeka isebenza kunye ne-Ayar Labs ukuphonononga izisombululo zonxibelelwano lwe-bandwidth ephezulu epakishweyo, ivula indlela yokuveliswa kobuninzi be-optoelectronic co-packaging kunye nezixhobo zonxibelelwano olubonakalayo.
Nangona iimodyuli eziplaga ziselukhetho lokuqala, uphuculo olupheleleyo lwamandla anokuziswa yiCPO lutsale abavelisi abaninzi. Ngokutsho kwe-LightCounting, ukuthunyelwa kwe-CPO kuya kuqalisa ukunyuka kakhulu ukusuka kwi-800G kunye ne-1.6T izibuko, ngokuthe ngcembe iqala ukufumaneka ngokurhweba ukusuka kwi-2024 ukuya kwi-2025, kwaye yenza umthamo omkhulu ukusuka kwi-2026 ukuya kwi-2027. Ngelo xesha, i-CIR ilindele ukuba ingeniso yemarike yokupakishwa kwefotoelectric iyonke iya kufikelela kwi-5.4 yeebhiliyoni zeedola ngo-2027.

Kwangoko kulo nyaka, i-TSMC ibhengeze ukuba iya kuhlangana neBroadcom, iNvidia kunye nabanye abathengi abakhulu ukuphuhlisa ngokudibeneyo iteknoloji ye-silicon photonics, ukupakishwa okuqhelekileyo kwamacandelo e-CPO kunye nezinye iimveliso ezintsha, iteknoloji yenkqubo ukusuka kwi-45nm ukuya kwi-7nm, kwaye yathi isiqingatha sesibini esikhawulezayo. kunyaka ozayo waqala ukuhlangabezana umyalelo omkhulu, 2025 okanye kunjalo ukufikelela kwinqanaba umthamo.
Njengentsimi yeteknoloji ye-interdisciplinary ebandakanya izixhobo ze-photonic, iisekethe ezidibeneyo, ukupakishwa, ukulinganisa kunye nokulinganisa, iteknoloji ye-CPO ibonakalisa utshintsho oluziswa yi-optoelectronic fusion, kwaye utshintsho oluziswa kukuhanjiswa kwedatha ngokungathandabuzekiyo luyaphambuka. Nangona ukusetyenziswa kwe-CPO kunokubonwa kuphela kumaziko amakhulu edatha ixesha elide, kunye nokwandiswa okungaphezulu kwamandla amakhulu ekhompyutheni kunye neemfuno eziphezulu ze-bandwidth, iteknoloji ye-CPO photoelectric co-seal seal ibe yindawo entsha yokulwa.
Ingabonwa ukuba abavelisi abasebenza kwi-CPO ngokubanzi bakholelwa ukuba i-2025 iya kuba yinto ephambili, ekwayi-node enezinga lokutshintshiselwa kwe-102.4Tbps, kunye nokungalungi kweemodyuli ezidibeneyo ziya kwandiswa ngakumbi. Nangona izicelo ze-CPO zinokuza kancinci, i-opto-electronic co-packaging iyindlela yodwa yokufikelela kwisantya esiphezulu, i-bandwidth ephezulu kunye nothungelwano lwamandla aphantsi.