Uphuhliso kunye nenkqubela phambili ye-CPOi-optoelectroniciteknoloji yokupakisha kunye
Ukupakisha nge-optoelectronic asiyoteknoloji intsha, uphuhliso lwayo lunokulandelwa emva kwiminyaka yoo-1960, kodwa okwangoku, ukupakisha nge-photoelectric co-packaging yiphakheji elula nje.izixhobo ze-optoelectronickunye. Ngeminyaka yoo-1990, ngokunyuka kwe-imodyuli yonxibelelwano lwe-opticalKwishishini, ukuhlanganiswa kwe-photoelectric kwaqala ukuvela. Ngenxa yokwanda kwamandla aphezulu ekhompyutha kunye nemfuno ephezulu ye-bandwidth kulo nyaka, ukuhlanganiswa kwe-photoelectric, kunye netekhnoloji yayo enxulumene nayo, iphinde yafumana ingqwalasela eninzi.
Ekuphuhlisweni kwetekhnoloji, inqanaba ngalinye lineendlela ezahlukeneyo, ukusuka kwi-2.5D CPO ehambelana nemfuno ye-20/50Tb/s, ukuya kwi-2.5D Chiplet CPO ehambelana nemfuno ye-50/100Tb/s, kwaye ekugqibeleni ifezekisa i-3D CPO ehambelana nesantya se-100Tb/s.
I-2.5D CPO ipakishaimodyuli yokukhanyakunye netshiphu yokutshintsha inethiwekhi kwisiseko esifanayo ukuze kufinyezwe umgama womgca kwaye kwandiswe uxinano lwe-I/O, kwaye i-3D CPO iqhagamshela ngokuthe ngqo i-optical IC kumaleko ophakathi ukuze kufezekiswe uqhagamshelo lwe-I/O pitch engaphantsi kwe-50um. Injongo yophuhliso lwayo icacile kakhulu, oku kukunciphisa umgama phakathi kwemodyuli yokuguqula i-photoelectric kunye netshiphu yokutshintsha inethiwekhi kangangoko kunokwenzeka.
Okwangoku, i-CPO isesencinci, kwaye kusekho iingxaki ezifana nemveliso ephantsi kunye neendleko eziphezulu zokulungisa, kwaye bambalwa abavelisi kwimarike abanokubonelela ngokupheleleyo ngeemveliso ezinxulumene ne-CPO. YiBroadcom, Marvell, Intel, kunye nabanye abadlali abambalwa kuphela abanezisombululo ezizimeleyo kwimarike.
IMarvell yazisa utshintsho lwetekhnoloji ye-2.5D CPO isebenzisa inkqubo yeVIA-LAST kunyaka ophelileyo. Emva kokuba i-chip ye-silicon optical isetyenzisiwe, i-TSV isetyenzisiwe ngamandla okucubungula e-OSAT, kwaye emva koko i-chip flip-chip yombane yongezwa kwi-chip ye-silicon optical. Iimodyuli ze-optical ezili-16 kunye ne-chip yokutshintsha iMarvell Teralynx7 zidibene kwi-PCB ukwenza utshintsho, olunokufikelela kwisantya sokutshintsha se-12.8Tbps.
Kwi-OFC yalo nyaka, iBroadcom kunye neMarvell babonise isizukulwana samva nje seetships zokutshintsha ze-51.2Tbps besebenzisa itekhnoloji yokudibanisa i-optoelectronic.
Ukususela kwisizukulwana samva nje seenkcukacha zobugcisa ze-CPO zeBroadcom, iphakheji ye-CPO 3D ukuya ekuphuculeni inkqubo ukuze kufezekiswe uxinano oluphezulu lwe-I/O, ukusetyenziswa kwamandla e-CPO ukuya kwi-5.5W/800G, umlinganiselo wokusebenza kakuhle kwamandla ulungile kakhulu ukusebenza kakuhle kakhulu. Kwangaxeshanye, i-Broadcom ikwadlula kwi-wave enye ye-200Gbps kunye ne-102.4T CPO.
I-Cisco ikwanyuse utyalo-mali lwayo kwitekhnoloji ye-CPO, kwaye yenze umboniso wemveliso ye-CPO kwi-OFC yalo nyaka, ibonisa ukuqokelelwa kwayo kunye nokusetyenziswa kwetekhnoloji ye-CPO kwi-multiplexer/demultiplexer edibeneyo. I-Cisco ithe iza kuqhuba ukuthunyelwa kwe-CPO kovavanyo kwiiswitshi ze-51.2Tb, kulandele ukwamkelwa okukhulu kwimijikelo yokutshintsha ye-102.4Tb.
I-Intel sele iqalise ukusebenzisa ii-switches ezisekelwe kwi-CPO, kwaye kwiminyaka yakutshanje i-Intel iqhubekile nokusebenza ne-Ayar Labs ukuphonononga izisombululo zokunxibelelana kwesignali ye-bandwidth ephezulu ezihlanganisiweyo, zivula indlela yokuveliswa ngobuninzi kwezixhobo zokudibanisa ze-optoelectronic kunye nezixhobo zokudibanisa ze-optical.
Nangona iimodyuli ezinokuxhunywa ziseseyindlela yokuqala yokukhetha, ukuphuculwa kokusebenza kakuhle kwamandla okuziswa yi-CPO kuye kwatsala abavelisi abaninzi nangakumbi. Ngokutsho kwe-LightCounting, ukuthunyelwa kwe-CPO kuya kuqala ukunyuka kakhulu ukusuka kwizibuko ze-800G kunye ne-1.6T, kancinci kancinci kuqale ukufumaneka kurhwebo ukusuka ngo-2024 ukuya ku-2025, kwaye kube ngumthamo omkhulu ukusuka ngo-2026 ukuya ku-2027. Kwangaxeshanye, i-CIR ilindele ukuba ingeniso yemarike yokupakisha iyonke ye-photoelectric iya kufikelela kwi-$5.4 yeebhiliyoni ngo-2027.
Ekuqaleni kwalo nyaka, i-TSMC ibhengeze ukuba iza kudibana neBroadcom, iNvidia kunye nabanye abathengi abakhulu ukuphuhlisa itekhnoloji ye-silicon photonics, ii-common packaging optical components CPO kunye nezinye iimveliso ezintsha, itekhnoloji yenkqubo ukusuka kwi-45nm ukuya kwi-7nm, kwaye yathi isiqingatha sesibini esikhawulezayo sonyaka ozayo siqale ukuhlangabezana nomyalelo omkhulu, malunga nowama-2025 ukufikelela kwinqanaba levolumu.
Njengentsimi yetekhnoloji edibanisa izixhobo ze-photonic, iisekethe ezidibeneyo, ukupakisha, ukwenza imodeli kunye nokulinganisa, itekhnoloji ye-CPO ibonisa utshintsho oluziswa yi-optoelectronic fusion, kwaye utshintsho oluziswa ekudlulisweni kwedatha ngokungathandabuzekiyo luyaphazamisa. Nangona ukusetyenziswa kwe-CPO kunokubonwa kuphela kumaziko edatha amakhulu ixesha elide, kunye nokwandiswa ngakumbi kwamandla amakhulu ekhompyutha kunye neemfuno eziphezulu ze-bandwidth, itekhnoloji ye-CPO photoelectric co-seal iye yaba yindawo entsha yokulwa.
Kuyabonakala ukuba abavelisi abasebenza kwi-CPO ngokubanzi bakholelwa ukuba u-2025 uza kuba yi-node ephambili, ekwayi-node enezinga lokutshintshiselana le-102.4Tbps, kwaye iingxaki zeemodyuli ezixhunywayo ziya kwandiswa ngakumbi. Nangona usetyenziso lwe-CPO lunokufika kancinci, ukupakisha ngokubambisana kwe-opto-electronic ngokuqinisekileyo yindlela ekuphela kwayo yokufumana isantya esiphezulu, i-bandwidth ephezulu kunye neenethiwekhi zamandla aphantsi.
Ixesha lokuthumela: Epreli-02-2024