Yazisa inkqubo yokupakisha izixhobo ze-optoelectronic
Ukupakishwa kwenkqubo yesixhobo se-OptoelectronicIsixhobo se-OptoelectronicUkupakishwa kwenkqubo yinkqubo yokudibanisa inkqubo ukupakisha izixhobo ze-optoelectronic, izinto ze-elektroniki kunye nezixhobo zokusebenza ezisebenzayo. Ukupakishwa kwezixhobo ze-optoelectronic kusetyenziswa kakhulu kwiunxibelelwano lwe-opticalinkqubo, iziko ledatha, i-industrial laser, isiboniso se-civil optical kunye nezinye iindawo. Ingahlulwahlulwa ngokubanzi ibe ngamanqanaba alandelayo okupakisha: ukupakisha kwinqanaba le-chip IC, ukupakisha isixhobo, ukupakisha imodyuli, ukupakisha kwinqanaba lebhodi yenkqubo, ukuhlanganiswa kwenkqubo engaphantsi kunye nokuhlanganiswa kwenkqubo.
Izixhobo ze-Optoelectronic zahlukile kwizixhobo ze-semiconductor eziqhelekileyo, ukongeza ekubeni ziqulethe izinto zombane, kukho iindlela ze-optical collimation, ngoko ke ulwakhiwo lwephakheji yesixhobo luyinkimbinkimbi ngakumbi, kwaye luhlala luqulunqwe ziinxalenye ezahlukeneyo. Ezi nxalenye zihlala zinezakhiwo ezimbini, enye yile ye-laser diode,isixhobo sokubona iifotokunye nezinye iindawo zifakelwe kwiphakheji evaliweyo. Ngokwesicelo sayo, ingahlulwahlulwa ibe yiphakheji esemgangathweni yorhwebo kunye neemfuno zabathengi zephakheji eyiyo. Iphakheji esemgangathweni yorhwebo ingahlulwahlulwa ibe yiphakheji ye-coaxial TO kunye nephakheji yebhabhathane.
Iphakheji ye-1.TO Iphakheji ye-Coaxial ibhekisa kwizinto ezibonakalayo (i-laser chip, i-backlight detector) kwityhubhu, ilensi kunye nendlela ye-optical yefayibha eqhagamshelweyo yangaphandle zikwi-axis efanayo ye-core. I-laser chip kunye ne-backlight detector ngaphakathi kwesixhobo sephakheji ye-coaxial zifakwe kwi-thermic nitride kwaye ziqhagamshelwe kwisekethe yangaphandle ngentambo yegolide. Ngenxa yokuba kukho ilensi enye kuphela kwiphakheji ye-coaxial, ukusebenza kakuhle kwe-coupling kuphuculwe xa kuthelekiswa nephakheji yebhabhathane. Izinto ezisetyenziselwa igobolondo letyhubhu ye-TO ikakhulu yintsimbi engatyiwayo okanye i-Corvar alloy. Lonke ulwakhiwo lwenziwe ngesiseko, ilensi, ibhloko yokupholisa yangaphandle kunye nezinye iindawo, kwaye ulwakhiwo luyi-coaxial. Ngokwesiqhelo, i-TO packaging laser ngaphakathi kwe-laser chip (LD), i-backlight detector chip (PD), i-L-bracket, njl. Ukuba kukho inkqubo yolawulo lobushushu bangaphakathi efana ne-TEC, i-thermistor yangaphakathi kunye ne-control chip nazo ziyafuneka.
2. Iphakheji yebhabhathane Ngenxa yokuba imo ifana nebhabhathane, le fom yephakheji ibizwa ngokuba yiphakheji yebhabhathane, njengoko kubonisiwe kuMfanekiso 1, imo yesixhobo sokukhanya sebhabhathane. Umzekelo,ibhabhathane i-SOA(IsiNgesi)i-amplifier ye-optical ye-butterfly semiconductor）. Itekhnoloji yephakheji yebhabhathane isetyenziswa kakhulu kwinkqubo yonxibelelwano lwefayibha ye-optical transmission ekhawulezayo neyomgama omde. Ineempawu ezithile, ezinje ngendawo enkulu kwiphakheji yebhabhathane, kulula ukuyifaka i-thermoelectric cooler ye-semiconductor, kwaye ifezekise umsebenzi wolawulo lobushushu ohambelanayo; I-laser chip enxulumene nayo, ilensi kunye nezinye izinto kulula ukuzilungiselela emzimbeni; Imilenze yepayipi isasazwa kumacala omabini, kulula ukuyiqonda uqhagamshelo lwesekethe; Isakhiwo silungele uvavanyo kunye nokupakishwa. Igobolondo lidla ngokuba yi-cuboid, isakhiwo kunye nomsebenzi wokuphunyezwa zihlala zintsonkothile ngakumbi, zinokufakwa kwifriji eyakhelwe ngaphakathi, isinki yobushushu, ibhloko yesiseko se-ceramic, i-chip, i-thermistor, ukujonga i-backlight, kwaye zinokuxhasa iintambo zokubopha zazo zonke izinto ezingentla. Indawo enkulu yegobolondo, ukusasazwa kobushushu okuhle.
Ixesha leposi: Disemba-16-2024