Yazisa ukupakishwa kwenkqubo yezixhobo ze-optoelectronic

Yazisa ukupakishwa kwenkqubo yezixhobo ze-optoelectronic

Ukupakishwa kwenkqubo yesixhobo se-OptoelectronicIsixhobo se-Optoelectronicukupakishwa kwenkqubo yinkqubo yokudibanisa inkqubo yokupakisha izixhobo ze-optoelectronic, amacandelo e-elektroniki kunye nezixhobo zokusebenza ezisebenzayo. Ukupakishwa kwesixhobo se-Optoelectronic kusetyenziswa kakhulu kwiunxibelelwano lwamehloinkqubo, iziko ledatha, i-laser yoshishino, umboniso we-civil optical kunye nezinye iinkalo. Inokuthi ihlulwe ngokubanzi kumanqanaba alandelayo okupakisha: ukupakishwa kwenqanaba le-chip IC, ukupakishwa kwesixhobo, ukupakishwa kwemodyuli, ukupakishwa kwenqanaba lebhodi yenkqubo, indibano ye-subsystem kunye nokudibanisa inkqubo.

Izixhobo ze-Optoelectronic zihluke kwizixhobo eziqhelekileyo ze-semiconductor, ngaphezu kokuqulatha amacandelo ombane, kukho iindlela zokudibanisa i-optical, ngoko ke isakhiwo sephakheji yesixhobo sinzima kakhulu, kwaye ngokuqhelekileyo siqulunqwa ngamacandelo athile ahlukeneyo. Amacandelo angaphantsi ngokubanzi anezakhiwo ezibini, enye yeyokuba i-laser diode,isixhobo sokufotakunye nezinye iindawo zifakwe kwiphakheji evaliweyo. Ngokwesicelo sayo sinokwahlulwa sibe yiphakheji esemgangathweni yorhwebo kunye neemfuno zabathengi bepakethe yobunini. Iphakheji esemgangathweni yorhwebo inokwahlulwa ibe yi-coaxial TO package kunye ne-butterfly package.

Iphakheji ye-1.TO ye-Coaxial ibhekisela kumacandelo e-optical (i-laser chip, i-backlight detector) kwi-tube, i-lens kunye nendlela ye-optical ye-fiber edibeneyo yangaphandle ikwi-axis ye-core efanayo. I-laser chip kunye ne-backlight detector ngaphakathi kwesixhobo sephakheji ye-coaxial zifakwe kwi-nitride ye-thermic kwaye zixhunywe kwisiphaluka sangaphandle ngentambo yegolide. Kuba inye kuphela ilensi kwipakethe ye-coaxial, ukusebenza kakuhle kokudibanisa kuyaphucuka xa kuthelekiswa nephakheji yebhabhathane. Izinto ezisetyenziselwa i-TO ityhubhu igobolondo ubukhulu becala yintsimbi engatyiwa okanye iCorvar alloy. Isakhiwo sonke senziwe ngesiseko, i-lens, ibhloko yokupholisa yangaphandle kunye nezinye iindawo, kwaye isakhiwo si-coaxial. Ngokuqhelekileyo, ukupakisha i-laser ngaphakathi kwe-laser chip (LD), i-backlight detector chip (PD), i-L-bracket, njl. Ukuba kukho inkqubo yokulawula ukushisa kwangaphakathi njenge-TEC, i-thermistor yangaphakathi kunye ne-chip yokulawula nayo iyafuneka.

2. Iphakheji yebhabhathane Ngenxa yokuba imilo ifana nebhabhathane, le fomu yephakheji ibizwa ngokuba yi-butterfly package, njengoko kubonisiwe kuMzobo 1, imilo yesixhobo sokubona ibhabhathane lokutywina. Umzekelo,ibhabhathane SOA(butterfly semiconductor optical amplifier）.Iteknoloji yephakheji yebhabhathane isetyenziswa kakhulu kwisantya esiphezulu kunye nenkqubo yonxibelelwano yonxibelelwano lomgama omde. Ineempawu ezithile, ezinjengendawo enkulu kwiphakeji yebhabhathane, kulula ukuyifaka i-semiconductor thermoelectric cooler, kwaye iqonde umsebenzi ohambelana nolawulo lobushushu; I-laser chip ehambelanayo, ilensi kunye namanye amacandelo kulula ukucwangciswa emzimbeni; Imilenze yombhobho isasazwa kumacala omabini, kulula ukuqonda ukudibanisa kwesiphaluka; Isakhiwo sikulungele ukuvavanya kunye nokupakishwa. Igobolondo idla ngokuba yi-cuboid, isakhiwo kunye nomsebenzi wokuphunyezwa ngokuqhelekileyo unzima kakhulu, unokwakhiwa kwifriji, i-heat sink, ibhloko yesiseko se-ceramic, i-chip, i-thermistor, i-backlight monitoring, kwaye inokuxhasa i-bonding lead of all the components ngasentla. Indawo enkulu yegobolondo, ukuchithwa kakuhle kobushushu.